Multi-layer circuit board, method of manufacturing the same, and communication device
US8330051B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2010 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Dec 19, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer circuit board, a method of manufacturing the same, and a communication device are provided. As for the multi-layer circuit board, a slot segment is opened on at least one daughter board to form a first daughter board. At least one daughter board and medium layers are stacked together. The daughter boards include first daughter boards. The first daughter boards are placed in such a way that the slot segments of the first daughter boards are communicated. The slot segments are communicated to form a receiving slot. A heat conducting block is placed within the receiving slot. Each medium layer is sandwiched between the daughter boards. The stacked daughter boards, medium layers, and heat conducting block are pressed together, and the pressed daughter boards and heat conducting block are made into a multi-layer circuit board. The heat conducting block is embedded when the circuit board is pressed, thereby simplifying the assembling process of the heat conducting block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.