Method and apparatus for verifying a laser etch
US8330074B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 16, 2009 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Aug 4, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for verifying a laser etch on a rubber sample. In one embodiment, the apparatus includes a tire production line, a sample holding device, a laser having a diode, and a servo-assembly. The laser of the apparatus is configured to etch indicia on a sidewall of a tire on the tire production line and is further configured to etch at least one line in a rubber sample on the sample holding device. In one embodiment, the method includes etching a production tire with a laser, interrupting the laser, moving the laser to a laser diode testing location, loading a rubber sample in a holding device, etching at least one line into the rubber sample with the laser, manually or automatically measuring a depth of the at least one line, and comparing the depth of the at least one line to an acceptable line depth range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.