Ultrasound imaging transducer acoustic stack with integral electrical connections
US8330333B2 · kind B2 · utility
3Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2010 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Jul 28, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1082
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An ultrasound transducer that includes a backing layer, an insulating layer disposed on top of the backing layer, and a plurality of conductive traces disposed on top of the insulating layer are disclosed. Each of the conductive traces has an upper face. A plurality of transducer elements, each having (a) a core of piezoelectric material and (b) a conductive coating disposed beneath the core, are bonded directly to the upper face of a respective one of the plurality of conductive traces. Methods for fabricating ultrasound transducers are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.