Probe assembly and manufacturing method thereof
US8330481B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Apr 21, 2008 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Oct 19, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06744
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe assembly has insertion holes formed in a base layer provided on a circuit board. Probe pins are inserted into the insertion holes and fixed by a conductive adhesive filled in the insertion holes. The probe pins can be arranged with small pitch without mechanically electrically interfering with neighboring pins using the insertion holes. Furthermore, the base layer is formed of a semiconductor material to prevent a problem caused by a difference in the coefficient of thermal expansion between the base layer and a wafer. Moreover, coplanarity and alignment accuracy of the probe pins can be improved using aligning mask layers or aligning mask in a process of manufacturing the probe assembly. In addition, probe assembly manufacturing time can be reduced by using a pin array frame into which a large number of probe pins are temporarily inserted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.