Electronic interface apparatus and method and system for manufacturing same
US8333004B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2008 |
| Grant date | Dec 18, 2012 |
| Priority date | — |
| Expiry date | Dec 16, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a conductor in each of the apertures, connecting the antenna to the conductor, forming a recess in the substrate layer, attaching continuous connection wires to a plurality of chip modules, attaching the continuous connection wires to a plurality of conductors on a corresponding plurality of the substrate layers, cutting the continuous connection wires so as to retain portions thereof which connect each chip module to a corresponding pair of conductors and sealing the chip module in the recess.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.