Method of forming electrode placement and connection systems
US8333012B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2009 |
| Grant date | Dec 18, 2012 |
| Priority date | — |
| Expiry date | Apr 28, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Electrode placement and connection systems are described which allow for the electrical connection and maintenance of one or more electrodes positioned on a substrate which is subjected to a variety of mechanical stresses. Such a system may include an imaging hood having an aperture through which transparent fluid is flowed and one or more electrodes positioned along or about the hood. As the hood is configured between a low-profile and opened configuration, these electrodes may remain electrically coupled despite the mechanical stresses subjected to the electrodes and the connections thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.