Patent · US Active

Method of forming electrode placement and connection systems

US8333012B2 · kind B2 · utility

63Cited by
332References
5Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 8, 2009
Grant dateDec 18, 2012
Priority date
Expiry dateApr 28, 2031

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49222
  • WIPO fieldMedical technology
  • WIPO sectorInstruments

Abstract

Electrode placement and connection systems are described which allow for the electrical connection and maintenance of one or more electrodes positioned on a substrate which is subjected to a variety of mechanical stresses. Such a system may include an imaging hood having an aperture through which transparent fluid is flowed and one or more electrodes positioned along or about the hood. As the hood is configured between a low-profile and opened configuration, these electrodes may remain electrically coupled despite the mechanical stresses subjected to the electrodes and the connections thereto.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.