Monitoring electrical continuity for envelope seal integrity
US8333855B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 2, 2009 |
| Grant date | Dec 18, 2012 |
| Priority date | — |
| Expiry date | Mar 30, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB31B2160/102
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for producing an envelope having improved seal integrity, comprising the steps of (i) applying a first conductive material to the flap of the envelope in an first area corresponding to a first seal location between the flap and the body portion of the envelope and (ii) applying a second conductive material to the body portion of the envelope in a second area corresponding to a second seal location between the body portion and flap of the envelope, the first and second seal locations being selected such that an end of the first conductive material contacts an end of the second conductive material when the conductive materials are arranged in a substantially common plane. The method further comprises the steps of sealing the flap to the body portion by closing the flap onto the body portion of the envelope to cause the conductive materials to lie in the substantially common plane, and inspecting the sealing interface to determine whether the conductive materials exhibit a property of electrical continuity thereby confirming that a seal has been formed between the flap and body portion of the envelope. A system and article is also described for producing an envelope having im…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.