Method of transferring a micro device
US8333860B1 · kind B1 · utility
245Cited by
36References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2012 |
| Grant date | Dec 18, 2012 |
| Priority date | — |
| Expiry date | Feb 13, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1776
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.