Method for stacking devices
US8334170B2 · kind B2 · utility
6Cited by
56References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2008 |
| Grant date | Dec 18, 2012 |
| Priority date | — |
| Expiry date | Oct 25, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a semiconductor device is provided which includes providing a first device, a second device, and a third device, providing a first coating material between the first device and the second device, the first coating material being uncured, providing a second coating material between the second device and the third device, the second coating material being uncured, and thereafter, curing the first and second coating materials in a same process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.