Manufacturing method of LED package structure

US8334175B1 · kind B1 · utility

Assignee

• ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. · TW

Inventors

• Chih-Hsun Ke · Hsinchu, TW
• Ming-Ta Tsai · Hsinchu, TW

Key dates

• Filing date: Apr 9, 2012
• Grant date: Dec 18, 2012
• Expiry date: Apr 9, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857

Abstract

A method for manufacturing a holder of an LED package structure includes steps: providing first and second electrical portions; providing a mold including an upper die and a bottom die, the bottom die defining a receiving groove in a top surface thereof, the upper die including a core component and a wall around and spaced from the core component; putting the first and second electrical portions in the receiving groove of the bottom die, mounting the upper die on the bottom die; injecting liquid molding material into the receiving groove of the bottom die through a sprue between the wall and the core component; solidifying the liquid molding material and removing the upper die and the bottom die to obtain the holder which includes the first and second electrical portions and the solidified liquid molding material.