Optimized multi-layer printing of electronics and displays
US8334464B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2006 |
| Grant date | Dec 18, 2012 |
| Priority date | — |
| Expiry date | Dec 26, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for making a printed circuit board comprising a substrate and an electrical circuit is provided. The circuit is formed by deposition of a plurality of electronic inks onto the substrate and curing of each of the electronic inks. The deposition may be performed using an ink-jet printing process. The inkjet printing process may include the step of printing a plurality of layers, wherein a first layer includes at least one electronic ink deposited directly onto the substrate, and wherein each subsequent layer includes at least one electronic ink deposited on top of at least a portion of a previous layer when the previous layer has been cured. One or more of the layers may include at least two of the electronic inks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.