Manufacturing method for contact pads of a thin film transistor array panel, and a thin film transistor array panel having such contact pads
US8334539B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2009 |
| Grant date | Dec 18, 2012 |
| Priority date | — |
| Expiry date | Sep 9, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/451
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A thin film transistor array panel includes a first insulation substrate, a plurality of data wires formed on the first insulation substrate and extending in a first direction, a data pad region formed on the first insulation substrate and having plural ones of the data wires extending therefrom, and an organic layer formed on the data wires, where the organic layer has a greater thickness where it is disposed over the data wires than the thickness it has between the data wires. The surface of the organic layer of the data pad region includes minute slit patterns that extend parallel to the first direction of the data wires, and the data wires have line boundaries of a zigzag shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.