Circuit component with conductive layer structure
US8334588B2 · kind B2 · utility
2Cited by
197References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2011 |
| Grant date | Dec 18, 2012 |
| Priority date | — |
| Expiry date | Apr 29, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit component comprising a substrate, and a conductive layer over the substrate, wherein the conductive layer comprises a first portion between a first opening in the conductive layer and a second opening in the conductive layer, wherein the first and second openings are enclosed by the conductive layer, wherein a void is over the substrate and under the conductive layer, wherein the first portion and the first and second openings are over the void.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.