Disk drive with a solder preform hermetic seal
US8335050B2 · kind B2 · utility
12Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2007 |
| Grant date | Dec 18, 2012 |
| Priority date | — |
| Expiry date | Jun 5, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming a seal for hermetically sealing a hard disk drive assembly. The method includes forming a solder channel within a top cover of a disk drive enclosure and disposing a solder preform on a base of the disk drive enclosure such that the solder preform aligns with the solder channel when the top cover is positioned on the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.