Insulating aperture in printed circuit boards
US8335077B2 · kind B2 · utility
3Cited by
22References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2008 |
| Grant date | Dec 18, 2012 |
| Priority date | — |
| Expiry date | Mar 11, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49135
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system contains a temperature sensitive device and a printed circuit board. The temperature sensitive device is coupled to the printed circuit board. An aperture is cut out of the printed circuit board between the temperature sensitive device and a heat generating device to act as an insulator for the temperature sensitive device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.