Heat dissipating apparatus
US8335082B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 28, 2011 |
| Grant date | Dec 18, 2012 |
| Priority date | — |
| Expiry date | Aug 9, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipating apparatus comprises a cooler, an air duct, and a cooling fan. a cooler secured to a circuit board of a host; the cooler is secured to a circuit board of a host; the air duct, covers the cooler, comprises a side tray that is substantially perpendicular to the circuit board; the cooling fan is secured to the cooler and located on a side of the cooler, and adjacent to the side tray; a gap is defined between the side tray and the cooler, an air guiding board is located in the gap and extends towards a VRM that is secured to the circuit board, and the air guiding board is configured to direct air flowing towards the VRM.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.