Semiconductor module
US8335086B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2010 |
| Grant date | Dec 18, 2012 |
| Priority date | — |
| Expiry date | Apr 11, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A top panel, which is disposed to face a module board with an electronic component therebetween, includes a resin layer and a metal layer, and has an insulating characteristic. The metal layer includes a metal layer formed at a front side of the resin layer and a metal layer formed at a rear side of the resin layer. With this structure, in reflow soldering performed in mounting a semiconductor module on a main board, warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the front side of the resin layer is cancelled by warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the rear side of the resin layer, whereby warp of the top panel is eliminated. This helps prevent the electronic component adhered to the top panel with adhesive from being pressed down to or pulled up from the module board due to warp of the top panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.