Patent · US Active

Thermal evaporation apparatus, use and method of depositing a material

US8336489B2 · kind B2 · utility

0Cited by
24References
12Claims
0Family size

Inventors

Key dates

Filing dateOct 18, 2011
Grant dateDec 25, 2012
Priority date
Expiry dateOct 18, 2031

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C14/28
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A thermal evaporation apparatus for depositing of a material on a substrate is described. The apparatus can comprise material storage means; heating means to generate a vapour of the material in the material storage means; vapour outlet means comprising a vapour receiving pipe having vapour outlet passages, and emission reducing means arranged such that an external surface of the vapour outlet means directed to said substrate exhibits low emission. Also the use of the apparatus, and a method of depositing a material onto a substrate by thermal evaporation are described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.