Mechanical attachment of thermally stable diamond to a substrate
US8336648B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2011 |
| Grant date | Dec 25, 2012 |
| Priority date | — |
| Expiry date | Sep 2, 2031 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/5735
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
The present disclosure provides mechanical attachments of TSD body to a carrier or substrate sufficient to allow eventual conventional attachment of the TSD to a drill bit or other component. According to one aspect, the disclosure includes a composite assembly including a thermally stable diamond (TSD) body and a substrate with aligned holes and a joining pin located in the aligned holes to mechanically attach the TSD body and substrate. The composite assembly may lack any non-mechanical attachment between the TSD body and the substrate, or may lack particular types of non-mechanical attachments. The disclosure also provides drill bits and other devices containing such composite assemblies as well as methods of making such composite assemblies and drill bits or other devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.