Polishing pad
US8337282B2 · kind B2 · utility
15Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2007 |
| Grant date | Dec 25, 2012 |
| Priority date | — |
| Expiry date | Sep 6, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a polishing pad which can improve qualities of an object to be polished by improving the flatness of the object. A polishing surface 1a of a polishing pad 1 is subjected to a mechanical process, such as buffing, so that the flatness of the surface is improved, and corrugations on the polishing surface have a cycle of 5 mm-200 mm and a largest amplitude of 40 μm or less. As a result, the flatness of the object polished by the polishing pad 1, such as a silicon wafer, is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.