High precision semiconductor chip and a method to construct the semiconductor chip
US8338192B2 · kind B2 · utility
7Cited by
19References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2009 |
| Grant date | Dec 25, 2012 |
| Priority date | — |
| Expiry date | May 13, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/22
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment for manufacturing an electronic circuit forms at least one first structure on a semiconductor substrate, determines at least one electrically defined characteristic of the at least one first structure, selects a reticle corresponding to the measured characteristic, and forms at least one additional structure on the semiconductor substrate with the selected reticle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.