Patent · US Active

Copper-oxygen adduct complexes, and methods of making and use

US8338600B2 · kind B2 · utility

2Cited by
1References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 27, 2008
Grant dateDec 25, 2012
Priority date
Expiry dateOct 27, 2028

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC07F5/027
  • WIPO fieldOrganic fine chemistry
  • WIPO sectorChemistry

Abstract

The invention at hand describes Cu-(II)-oxygen adduct complexes, which are stable at room temperature, as well as methods for their production. In this, compounds of the general formula [L-Cu—O—O—Cu-L](BAr4)2 are concerned. Here, BAr4− is a tetraarylborate anion, selected from tetraphenylborate and tetrakis(3,5-trifluoromethyl)phenylborate. L represents a tripodal tetradentate ligand, wherein, each of the four binding sites of the tripodal tetradentate ligand is a nitrogen atom. Each of the three podal ligands is suitable for comprising an aliphatic amine or a nitrogen-containing heteroaromatic compound independently of one another. A bridge of one to four carbon atoms is located between the central nitrogen atom and the nitrogen atom of each of the podal ligands.The Cu-(II)-oxygen adduct complexes according to the present invention are produced, by initially reacting the ligand L with a Cu-(I) salt to [Cu-L]X. Subsequently, the anion X of the Cu-(I) complex [Cu-L]X is replaced with tetraarylborate and the compound [Cu-L]BAr4 obtained in this way is finally exposed to an oxygen-containing atmosphere. Hereby, [L-Cu—O—O—Cu-L](BAr4)2 is formed.The Cu-(II)-oxygen adduct complexes are s…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.