Method for processing a memory link with a set of at least two laser pulses
US8338746B2 · kind B2 · utility
10Cited by
197References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2010 |
| Grant date | Dec 25, 2012 |
| Priority date | — |
| Expiry date | Feb 12, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/94
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.