Solid state light sheet or strip having cavities formed in top substrate
US8338842B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2011 |
| Grant date | Dec 25, 2012 |
| Priority date | — |
| Expiry date | May 3, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.