Micro electro mechanical system (MEMS) microphone having a thin-film construction
US8338898B2 · kind B2 · utility
9Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2005 |
| Grant date | Dec 25, 2012 |
| Priority date | — |
| Expiry date | Apr 10, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2307/207
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An MEMS microphone is bonded onto the surface of an IC component containing at least one integrated circuit suitable for the conditioning and processing of the electrical signal supplied by the MEMS microphone. The entire component is simple to produce and has a compact and space-saving construction. Production is accomplished in a simple and reliable manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.