Power semiconductor module with connection elements electrically insulated from one another

US8338942B2 · kind B2 · utility

Assignee

• SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

• Marco Lederer · Hirschaid, DE
• Rainer Popp · Petersaurach, DE

Key dates

• Filing date: Jun 14, 2007
• Grant date: Dec 25, 2012
• Expiry date: Jun 14, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K1/0263
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A power semiconductor module, for placement on a cooling component. The module includes a substrate, at least two power semiconductor components arranged on the substrate, a housing and outwardly routed load and control connections. The substrate has an insulator body with a first main area that faces the interior of the power semiconductor module, and has interconnects at load potential arranged thereon. Each load connection is formed as a shaped metal body with outer contacts, a strip-like section and with inner contacts extending from the strip-like section to the substrate and making circuit-compliant contact therewith. In addition, the load connections are substantially completely encased by insulation except in the vicinity of the outer and inner contacts and accordingly are electrically insulated from one another.