Module having a stacked magnetic device and semiconductor device and method of forming the same
US8339802B2 · kind B2 · utility
15Cited by
147References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2009 |
| Grant date | Dec 25, 2012 |
| Priority date | — |
| Expiry date | Jul 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A module having a stacked magnetic device and semiconductor device, and method of forming the same. In one embodiment, the module includes a printed wiring board including a patterned conductor formed on an upper surface thereof. The module also includes a magnetic core mounted on the upper surface of the printed wiring board proximate the patterned conductor and a semiconductor device mounted on an upper surface of the magnetic core.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.