Method for forming sputter target assemblies having a controlled solder thickness
US8342383B2 · kind B2 · utility
2Cited by
12References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2006 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | Jun 11, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12931
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a method and apparatus of forming a sputter target assembly having a controlled solder thickness. In particular, the method includes the introduction of a bonding foil, between the backing plate and the sputter target, wherein the bonding foil is an ignitable heterogeneous stratified structure for the propagation of an exothermic reaction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.