Electrical socket having suitable receiving space for a solder ball of an IC package
US8342873B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2011 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | Aug 19, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/52
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical socket used to connecting an IC package to a printed circuit board comprises an insulative housing (2) and a plurality of contacts (1) received therein, the insulative housing (2) comprises a top surface (21), a bottom surface (22) opposite to the top surface (21) and a plurality of passageways (211) penetrated the top surface (21) and the bottom surface (22), the contact (1) comprises a body portion (10), a connecting portion (11) extending upwardly from the body portion (10) and a spring portion (12) extending horizontally from the connecting portion (11), the spring portion (12) comprises a supporting portion (120) at the end thereof touching with the insulative housing (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.