Polymer pi-bond-philic filler composites
US8343257B2 · kind B2 · utility
3Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2009 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | May 17, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/0806
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The instant invention generally provides polymer pi-bond-philic filler composite comprising a molecularly self-assembling material and a pi-bond-philic filler, and a process of making and an article comprising the polymer pi-bond-philic filler composite. The instant invention also generally provides a process of separating a pi-bond-philic gas from a separable gas mixture comprising the pi-bond-philic gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.