Hardenable reaction resin system
US8343270B2 · kind B2 · utility
5Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2004 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | Oct 30, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0257
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A hardenable epoxy-free reaction resin system, in particular a casting compound, lacquer, laminating or impregnating resin, which contains an epoxy-free resin component, a mineral filler, and polymer particles dispersed in the resin component. The filler includes nanoparticles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.