Patent · US Active

Hardenable reaction resin system

US8343270B2 · kind B2 · utility

5Cited by
4References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 10, 2004
Grant dateJan 1, 2013
Priority date
Expiry dateOct 30, 2029

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2201/0257
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A hardenable epoxy-free reaction resin system, in particular a casting compound, lacquer, laminating or impregnating resin, which contains an epoxy-free resin component, a mineral filler, and polymer particles dispersed in the resin component. The filler includes nanoparticles.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.