Method of producing a MEMS device

US8343369B2 · kind B2 · utility

Assignee

• Analog Devices, Inc. · US

Inventors

• Manolo Mena · Quezon, PH
• Elmer S. Lacsamana · San Fernando, PH
• William A. Webster · Tewksbury, US
• Lawrence E. Felton · Hopkinton, US

Key dates

• Filing date: Jul 14, 2011
• Grant date: Jan 1, 2013
• Expiry date: Jul 14, 2031

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C1/00896
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.