Method of forming variable patterns using a reticle
US8343716B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2008 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | Aug 11, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70541
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of forming a variable pattern across a wafer using a reticle forms a plurality of first patterns on the wafer. The first pattern is repeated across the wafer and each first pattern has a first readable element. The method also forms a plurality of second patterns on the wafer. The second patterns is repeated across the wafer and each second pattern has a second readable element. The second patterns are positioned relative to the first patterns by aligning a first second pattern relative to one portion of a corresponding first pattern and then incrementally misaligning each successive second pattern in a row or a column relative to its corresponding first pattern. Thus, each corresponding first readable element and second readable element form a corresponding variable pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.