Encapsulation for electronic and/or optoelectronic device
US8343802B2 · kind B2 · utility
10Cited by
0References
8Claims
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Assignee
Inventors
Key dates
| Filing date | Jul 18, 2007 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | Feb 26, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/311
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of processing a flexible encapsulation scheme to encapsulate a flexible device, such as a display device in order to provide structural support for the display module. An upper transparent encapsulation layer covers and protects the media and active area of the device. A lower encapsulation layer is deposited over the under side of the display to complete the encapsulation and the two protective encapsulation layers are sealed. A driver housing may be positioned at the opposite end of the device to the overlap region of the encapsulation layers in order to protect the driver electronics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.