Method for non-contact materials deposition
US8343869B2 · kind B2 · utility
19Cited by
0References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2009 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | Oct 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/013
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention are directed to a method of printing lines. The method may include depositing material on a substrate from a plurality of nozzles to form a multi-layered line of a desired cross section area or a desired height by dispensing the material in at least two layers in a single scan. Each layer may be printed by different nozzles and the number of layers in the line is determined based on the desired cross section area or height.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.