Semiconductor device and display apparatus
US8344486B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2009 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | Jul 7, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a COF of an embodiment of the present invention, the smaller distance to edges of a heat-releasing member an area of the heat-releasing member has, the larger openings the area has. Accordingly, a volume per area (an area per length) of the heat-releasing member decreases toward the edges. The arrangement improves flexibility of the COF. This prevents a stress caused by bending the COF from concentrating at the edges. This makes it possible to prevent a line on an insulating film from being broken. Also, it becomes possible to prevent an anisotropic conductive resin from coming off which is used to bond the COF with a display panel in providing the COF in a display apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.