Sequential approach for automatic defect recognition
US8345949B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2010 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | Mar 3, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30164
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of automatic defect recognition includes receiving a initial set of inspection image data of a scanned object from a scanning machine; applying a first image analysis algorithm to this set of inspection image data; then removing from the set of inspection image data any defect-free image regions, so as to retain a set of analyzed inspection image data; applying an additional image analysis algorithm(s) to the set of analyzed inspection image data, wherein the additional algorithm(s) has a higher computational cost than the first image analysis algorithm; and based on the applying of the additional image analysis algorithm(s), removing from the first set of inspection image data a second set of defect-free image regions, thereby retaining a set of twice-analyzed inspection image data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.