Seamless insert molding techniques
US8346183B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2008 |
| Grant date | Jan 1, 2013 |
| Priority date | — |
| Expiry date | Feb 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1352
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods and apparatus for using an insert molding process to form a tactilely seamless overall part from component parts that are made from different materials are disclosed. According to one aspect of the present invention, a housing includes a first part formed from a first material and a second part formed from a second material that is of a different type than the first material. The first part includes a first external surface and a first bonding surface, and the second part includes a second external surface and a second bonding surface. The second bonding surface can be integrally bonded to the first bonding surface so that the first external surface and the second external surface form a gap-free overall surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.