Electronic component mounting method
US8347494B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2009 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Aug 22, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53196
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mounting method for mounting an electronic component on a printed circuit board, the mounting method includes fixing a lower surface of a magnet panel to a magnetic body included in the electronic component by a magnetic force, seizing the electronic component by attracting a part of an upper surface of the magnet panel to an attaching unit, determining a position of the attracting unit to place the electronic component at a predetermined position with respect to the printed circuit board and releasing the attracting unit from the upper surface of the magnet panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.