Method for producing engineered wood flooring and product
US8347506B2 · kind B2 · utility
1Cited by
18References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 8, 2009 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Aug 15, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49982
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing an engineered wood flooring product including providing a flat plywood platform having an original thickness, sanding top and bottom surfaces of the platform to achieve a final thickness less than the original thickness, wherein the amount of material removed from the bottom surface is greater than the top surface to induce center lift in the platform, applying adhesive to the platform, applying a veneer face to the platform, and subjecting the lay-up to a lineal pressing system to ensure bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.