Sonic resonator system for testing the adhesive bond strength of composite materials
US8347723B2 · kind B2 · utility
19Cited by
16References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2010 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Apr 1, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/0231
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed herein is a sonic resonator system for use in testing the adhesive bond strength of composite materials. Also disclosed herein are a method of calibrating the sonic resonator system to work with a particular composite bond joint, and a method of non-destructive testing the “pass-fail” of the bonded composite bond strength, based on a required bond strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.