Patent · US Active

Smartcard interconnect

US8348171B2 · kind B2 · utility

0Cited by

2References

21Claims

0Family size

Assignee

Cubic Corporation · US

Inventors

Paul Amadeo · San Diego, US
Jose Luis Flores · Ontario, US
Robert Kraft · Monument, US

Key dates

Filing date	Feb 18, 2011
Grant date	Jan 8, 2013
Priority date	—
Expiry date	Feb 18, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49162
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A smart card inlay and method for assembling the same are provided. The method includes attaching a first trace to a substrate, attaching a second trace to the substrate, attaching an antenna wire to the substrate, coupling a first end of the antenna wire to a first area of the first trace, and coupling a second end of the antenna wire to a first area of the second trace. A second area of the first trace and a second area of the second trace are configured to be coupled to an integrated circuit (IC) or IC module, and the first area of the first trace is located away from the second area of the first trace and the first area of the second trace is located away from the second area of the second trace.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.