Micro device transfer head heater assembly and method of transferring a micro device
US8349116B1 · kind B1 · utility
203Cited by
36References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2012 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Feb 13, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1911
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.