Apparatuses and methods for manipulating droplets on a printed circuit board
US8349276B2 · kind B2 · utility
156Cited by
190References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2006 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Jan 3, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T436/2575
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Apparatuses and methods for manipulating droplets on a printed circuit board (PCB) are disclosed. Droplets are actuated upon a printed circuit board substrate surface by the application of electrical potentials to electrodes defined on the PCB. The use of soldermask as an electrode insulator for droplet manipulation as well techniques for adapting other traditional PCB layers and materials for droplet-based microfluidics are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.