Connecting structure for circuit board and connecting method using the same
US8350162B2 · kind B2 · utility
1Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2010 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Nov 24, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a connection structure for a circuit board using a solder bump to arrange circuit boards. The circuit board connection structure includes a solder bump prepared on one of two circuit boards and a perforated part formed at the other of the circuit boards to receive the solder bump. Facing both circuit boards towards each other and inserting the solder bump into the perforated part, the circuit boards are desirably arranged.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.