Patent · US Active

Method for laser machining transparent materials

US8350183B2 · kind B2 · utility

197Cited by

13References

11Claims

0Family size

Assignee

UNIVERSITAET ZU LUEBECK · DE

Inventors

Alfred Vogel · Lübeck, DE
Norbert Linz · Iphofen, DE
Sebastian Freidank · Stade, DE

Key dates

Filing date	Jun 7, 2008
Grant date	Jan 8, 2013
Priority date	—
Expiry date	Oct 9, 2029

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/50
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for machining a transparent material by the non-linear absorption of pulsed laser radiation, in the region of a laser focus, includes the following steps: a laser wavelength of between 300 and 1000 μm is selected; and laser impulses having a temporally flat beam profile are applied. The method is characterized in that the irradiation intensity is selected from an interval pre-determined for the material to be machined, in which plasma is formed without plasma luminescence. An apparatus for laser treating a transparent material includes structure to set an irradiance and inspect the treatment as being within a defined interval.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.