Miniaturized optical proximity sensor
US8350216B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2009 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Nov 12, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Various embodiments of a miniaturized optical proximity sensor are disclosed. In one embodiment, an ambient light sensor and a light detector are mounted on first and second spacers, which in turn are mounted to a top surface of an integrated circuit die-attached to a substrate. An optically-transmissive infrared pass compound is molded over the ambient light sensor, the light detector, the integrated circuit, a light emitter and peripheral portions of the substrate. Next, an optically non-transmissive infrared cut compound is molded over the optically-transmissive infrared pass compound to provide a miniaturized optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.