Semiconductor package, method of evaluating same, and method of manufacturing same
US8350263B2 · kind B2 · utility
7Cited by
0References
3Claims
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Assignee
Inventor
Key dates
| Filing date | Oct 28, 2010 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Dec 25, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a wiring board, a semiconductor device mounted on the wiring board, an electrically-conductive thermal interface material provided on the semiconductor device, a test electrode in contact with a first surface of the thermal interface material to be electrically connected to the thermal interface material, and an electrically-conductive heat spreader in contact with a second surface of the thermal interface material opposite to its first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.