Integrated MEMS devices with controlled pressure environments by means of enclosed volumes
US8350346B1 · kind B1 · utility
66Cited by
6References
22Claims
0Family size
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Key dates
| Filing date | Jul 3, 2012 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Jul 3, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/117
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An integrated MEMS device comprises a wafer where the wafer contains two or more cavities of different depths. The MEMS device includes one movable structure within a first cavity of a first depth and a second movable structure within a second cavity of a second depth. The cavities are sealed to maintain different pressures for the different movable structures for optimal operation. MEMS stops can be formed in the same multiple cavity depth processing flow. The MEMS device can be integrated with a CMOS wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.