Electric via comprising lateral outgrowths
US8350363B2 · kind B2 · utility
1Cited by
1References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2010 |
| Grant date | Jan 8, 2013 |
| Priority date | — |
| Expiry date | Jan 24, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06589
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A via connecting the front surface of a substrate to its rear surface, this substrate including a porous region extending from at least a portion of the periphery of the via, the via including outgrowths extending in pores of the porous region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.